工作機會
系統硬體設計工程師 (System Hardware Engineer)
工作內容:無線通訊系統設計應用
條件需求:
a. 射頻系統工程師:研究所以上,電子/電機/通訊相關系所畢,熟悉Cellular /WLAN射頻系統,具射頻電路設計與處理 EMI 、 Antenna 相關問題經驗者。
b. 基頻系統工程師:研究所以上,電子/電機/通訊/資工相關系所畢,熟悉Cellular/WLAN系統,對無線通訊系統硬體研發與應用有經驗或興趣者。
系統軟體設計工程師 (System Software Engineer)
工作內容:無線通訊協定軟韌體開發設計
條件需求:
a. 無線通訊系統底層軟體研發工程師:研究所以上,電子/電機/通訊/資工相關系所畢,熟悉 Cellular/WLAN 系統,對無線通訊系統底層軟體研發有經驗或興趣者。
b. 視窗驅動程式設計工程師:資訊/電機相關系所畢,熟悉 Windows driver programming ,對開發 Windows driver 有興趣,具開發經驗者佳。
c . 嵌入式系統研發工程師:資訊/電機相關系所畢,熟悉 C 、 C++ 、 Assembly 、 OS 與 Computer architecture ,對 RTOS 、 Embedded System 有開發經驗者;具有微處理器軟韌體程式設計經驗者佳。
射頻 IC 測試工程師 (RF IC Testing Engineer)
工作內容: RF IC test program developing,RF IC test fixture developing, RF IC良率分析控管 , RF IC測試分析控管 。
條件需求: 電子/電機相關科系畢, 有Teradyne Catalyst+uWave6000 、 Agilent HP84000 、 LTX Fusion等測試機臺的程式開發經驗者優先。
射頻 IC PDK 設計工程師 (RF IC PDK Engineer)
工作內容:
a. Development of customerized MM/RF design platform and methodology.
b. Integration of foundry and in-house spice models, EDA tools, and technology files to provide a set of process design kits(PDK).
c. Support and solve designers' design kit issues.
條件需求:
a. Minimum Master degree majoring in EE/CS/Physics.
b. Experience in design kits development or EDA programming.
c. Familiar with device physics, interconnect characterization and modeling.
d. Experience in MM/RF design is a plus.
射頻 IC 設計工程師 (RF IC Design Engineer)
工作內容: RF IC 設計開發
條件需求:電子/電機/通訊相關系所畢,具 RF IC 設計相關經驗或無經驗但主修線路設計者。
混合訊號 IC 設計工程師 ( Mixed Signal IC Design Engineer)
工作內容:類比及混合訊號電路設計
條件需求: 電子 / 電機相關研究所畢 , 具類比線路設計相關經驗, 或無經驗但主修線路設計者 。
IC 佈局工程師 ( IC Layout Engineer)
工作內容: Full Custom 類比 IC 電路佈局; APR 數位 IC 電路佈局。
條件需求:大學以上,限電子/電機/資訊科系畢,熟電子電路;熟悉 IC 佈局、驗證相關軟體;熟悉工作站 UNIX 操作;瞭解半導體製程觀念者佳。
CAD / EDA 工程師 (CAD / EDA Engineer)
工作內容:
a. Research and development of advanced MM/RF design EDA tools and DFM methodology.
b. Support and solve EDA issues from designers.
c. Discuss with EDA tools vendors about any MM/RF design EDA problems.
條件需求:
a. Minimum Master degree majoring in CS/EE/Math/Physics.
b. Must be familiar with programming languages such C/C++ and Java in UNIX/Linux environment.
c. Have a strong background in data structures and algorithms.
d. Relevant experience developing or using EDA tools is a plus.
軟體工程師 ( Software FAE)
工作內容: 軟體應用工程師 (大陸辦事處)。
條件需求:大學以上,限資訊工程系(軟體設計),熟C語言,匯編語言(組合語言);工作經驗2~3年。
SA助理工程師
工作內容:PCB焊接、測試,系統測試
條件需求: 電子相關科系、電機相關科系、通訊電信相關
行銷業務人員(Marketing Sales)
工作內容:行銷企劃公司產品
條件需求: 大學以上,限理工科系畢
會計助理
工作內容:簡易出納工作,兼業務助理(大陸辦事處)
條件需求: 大學以上,限財會相關科系畢;工作經驗2~3年。
國防役訓儲人員--國防役訓儲相關網頁
誠摯地歡迎您成為絡達的一份子, 請將資料寄至 job@airoha.com.tw
| | ![]() | ![]() | ![]() | | |||||||||||
| Careers Job Opportunities | |||||||||||||||
| | ProfileAiroha was established in August 2001, with initial capital of $6.3 million (NTD 200 million). With more than 50 employees, Airoha has been a leading wireless communication IC design company in Taiwan. The company mission is to provide high performance, cost effective and highly integrated RF/mixed signal IC for wireless communication applications. Company profile for downloading
Life in Airoha Benefits
Careers at Airoha Airoha welcome you to join us to be a worldwide key player in the high-growth demanding and ever changing requirements of the Wireless telecommunications industries.
for detail job description (in Chinese), please click here If you wish to apply for one of these openings, please e-mail to job@airoha.com.tw
Core Competence Vision To address the high-growth demanding and ever changing requirements of the Wireless Telecommunications industries, Airoha is a fabless semiconductor company that designs, develops and markets RF/mixed signal IC solutions for wireless applications. Airoha assembled an experienced group of knowledgeable system and circuit design engineering professionals. The distinguished combination of diverse expertise allows Airoha to provide wireless application makers with RF solutions and extensive technical support to accelerate their design cycle time. As a reliable suppliers, Airoha is committed to develop and offer cost effective ICs solutions for our customers to rapidly build and deliver their products with more functionality and higher performance. | ||||||||||||||
| | |||||||||||||||
| | |||||||||||||||
| | |||||||||||||||